IEEE Microwave Magazine, May 2023IMS Industry Focus

2023 HeaderIMS Industry FocusDamon Holmes and Gayle CollinsMMM3242850openerIEEE Microwave Week provides a forum for interaction among engineers from industry, academia, and government. The IEEE Microwave Theory and Technology Society (MTT-S) International Microwave Symposium (IMS) is especially interested in encouraging more participation by industry and has a number of initiatives in this area.Benefits of Participation by IndustryCompanies can realize huge benefits by participating at IMS. The exhibition, MicroApps Theater, and industry workshops are great practical ways to get started. So are industrial keynote speakers and regular IMS, RF Integrated Circuits Symposium, and Automatic Radio Frequency Techniques Group papers.Industry Keynote Speaker InitiativeIMS has long had a thriving industry participation contributing to both the technical and exhibition activities at Microwave Week. IMS has long been a place for business to do business, to showcase their cutting-edge research, and to lead our Society to the next level of microwave theory and technology. To highlight and present the technical view from industry leaders, the IMS2023 team is implementing the Industry Keynote Speaker initiative. For the first time, IMS has industry keynote speakers imbedded in the technical tracks. These 17 choice speakers have been nominated by their peers from MTT-S technical committees, and the talks are spread out among 17 technical tracks according to topic. The keynote presentations have been organized as much as possible so that they do not overlap, to give attendees the opportunity to see as many as they would like. Multiple technical tracks this year will have keynote speakers who are recognized industry leaders in their field and will give you an idea of the direction that companies are moving in and insights into research occurring in the private sector. Something to look for while attending this year’s IMS are keynote presentations from industry leaders from companies including Ericsson, Infineon, MA-COM, Google, HRL, ADI, Northrop Grumman, Anritsu, MathWorks, Keysight Technologies, and more.In addition to the industry keynotes, the authors of the best IMS papers from industry will be available to discuss their work at the industry showcase right before the IMS plenary on Monday.Top 10 Reasons Why Your Company Should Publish at IMSHas your organization considered submitting technical white papers? IMS papers offer a different medium to showcase your company’s work and stand out in the crowd. If your company has avoided the IMS paper format in the past, here are the top 10 reasons you should consider it:

worldwide recognition of your company’s technical achievement

elevate and recognize specific employees in your organization

enhance employee critical thinking and writing skills

promote new alternative and uncommon solutions to customers

canonize your company’s project in writing for future generations

create talking points with customers

highlight your company’s joint venture collaborations

attract previously unknown collaborators

show your customers that you can pass a technical peer review

encourage competition in your field of expertise.

So, enjoy this year’s IMS, but then start thinking about presenting a paper at next year’s, IMS2024. Submissions will be due about 1 December 2023.Industry WorkshopsThe industry workshops are 100-min industry-led presentations that feature hands-on practical solutions. They often include live demonstrations and attendee participation. These workshops are open to all attendees for a small fee. Sign up during the registration process.The industry workshops will be held in the convention center. Check the app and program book for the specific rooms. Workshops planned for this year are

“.01–20 GHz Small Form Factor Multiport Network Analyzer Design Accelerators,” by Larry Hawkins (Richardson) and Ed Woytasek (ADI)

“5G Front End Modules Principles,” by Florinel Baltineau and Tom Valencia (Skyworks)

“6G: Enabling the Path Towards THz Frequencies,” by Markus Loerner (Rohde & Schwarz), Navneet Sharma (Samsung Research), Deji Akinwande (University of Texas at Austin), Marco Dietz (Fraunhofer Institute), Amelia Hagelauer (TU Munich), and Paul Peterson (Rohde & Schwarz)

“Balancing Tradeoffs: Taming Signal Integrity Challenges in mmWave Antenna-to-Bits Implementations,” by Matthew Burns (Samtec), Steve Fireman (Otaxa), Giorgia Zucchelli (MathWorks), Luc Langlois (Avnet), and Markus Loerner (Rohde & Schwarz)

“Building a Hybrid Beamforming Digital Twin of Commercial Off the Shelf (COTS) Hardware Using Commercially Available EDA Software,” by Muthy Upmaka (Keysight Technologies) and Sam Ringwood (ADI)

“MBSE Introduction: Systems to Silicon and Back,” by Mark Sampson and Marl Malionski (International Council on Systems Engineering)

“Improved DUT Characterization by Virtue of Accurate Vector Signal Generation at a Remote (DUT) Plane,” by Marc Vanden Bossche, Markus Rullman, and Matthew Spexarth (National Instruments)

“GaN-on-SiC: From Technology to System Design Through Systematic and Accurate Modeling of Device Building Blocks,” by Yueying Liu (Wolfspeed)

“Phased Array System Modeling and Design Using MATLAB and Analog Devices Hardware,” by Noam Levine, Babak Memarzadeh, Vishwanath Iyer (MathWorks), Travis Collins, and Jon Kraft (ADI)

“Maximizing Return on Investment for On-Wafer Over-Temperature Millimeter-Wave Characterization,” by Gavin Fisher (Cascade Microtech)

“Production OTA and ORAN Testing for 5G mMIMO Radio,” by Kevin Loughran, Lin Lin (Jabil), and Ben Smythe (Keysight Technologies)

“Silicon to Phased Array Design, Analysis and AiP Implementation,” by David Vye (Cadence)

“Validating a CATR Benchtop OTA Test System for 5G FR2 Phased Array Antenna R&D Testing,” by Fabrizio Dourado, (Rohde & Schwarz), Shinnosuke Tsuchiya (Fujikura), and Luc Langlois (Avnet)

“Linearization of Upcoming High-Efficient RF Power Amplifiers Using Simulation and Hardware Measurements,” by Salvatore Finocchiaro (Qorvo), Markus Loerner (Rohde & Schwarz), Giorgia Zucchelli (MathWorks), and Florian Ramain (Rohde & Schwarz)

“mmWave Permittivity Standard Reference Material Development,” by Say Phommakesone (Keysight Technologies), Lucas Enright (National Institute of Standards and Technology), Marzena Olszewska-Placha (QWED), and Urmi Ray (International Electronics Manufacturing Initiative)

“Optimizing High Performance Wireless RF Front End Products Time-to-Market: From Engineered Substrates to Systems,” by Luis Andia (Soltec)

“DC-44 GHz Wireless Test System Design Accelerator Blocks for Wireless Test Systems,” by Larry Hawkins (Richardson), Bernard Gobell (Signal Craft Technologies), and Brian Shah (ADI)

“Co-Design Techniques for Wideband mmWave and SatCom Phased Array Systems,” by Cecile Masse (Avnet & Otava), Luc Langlois (Avnet), Giorgia Zucchelli (MathWorks), and Fabrizio Dourado (Rohde & Schwarz)

“Design Technology Co-Optimization (DTCO) of RF Power Amplifier Designs With GaN Device Technology,” by Nelson Braga (Synopsis)

“Advances In Multi-Technology Design Flow to Sign-Off,” by Michael Thompson (Cadence)

“Efficient Simulation of (Semi) Periodic Microwave Devices Using ANSYS HFSS,” by Faezeh Tork Ladani (ANSYS)

“Low-Loss 3D-Printed Flat Cylindrical GRIN Lens for 5dB Gain Enhancement of a 20dBi Horn Antenna,” by Colby Hobart (Fortify).

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