J.-C. Chiao, Ke Wu
The prestigious International Microwave Symposium (IMS 2023) in San Diego once again hosted the IEEE MTT-S Inter-Society Technology Panel (ISTP) program. This program aims to strengthen collaborations and exchange ideas on technologies of interest between the MTT-S and other entities, including the IEEE Societies, councils, and non-IEEE organizations. The panels are organized to facilitate coordinated conversations on emerging applications and future trends, bringing together diverse perspectives and interests. In this dynamic setting, the participants engage in multidisciplinary discussions, exploring the frontiers of research and development across various sectors. The ISTP program serves as a platform where all parties and partners involved can share their enthusiasm and collectively shape the future.
The panel “RF/Microwave Packaging and Interconnect Technologies for Global Integration—Are We on the Right Track?” was held at 12:00–1:30 p.m. on Wednesday 14 June 2023 (Figure 1). The panel organizers were Dr. Kamal Samanta (Sony Europe), Prof. Manos Tentzeris (Georgia Tech), Prof. Ke Wu (Polytechnique Montréal), and Prof. J.-C. Chiao [Southern Methodist University (SMU)]. Panelists included Dr. Kevin Gu (Metawave), Dr. Patrick Reynaert (KU Leuven and IMEC), Dr. Beth Keser [International Microelectronics Assembly and Packaging Society (IMAPS)], Prof. Premjeet Chahal (National Science Foundation), Dr. Harshpreet Bakshi (Texas Instruments), and Dr. Tim Lee (The Boeing Company). The panelists discussed present 3D integration and packaging methods and status as well as their projections for the near future. Antennas, phased arrays, and RFICs in heterogeneous integration, including system-in-package and system-on-package technologies, for communication and radar applications were also discussed. Dr. Keser, as the president of IMAPS North America, presented the overall efforts of electronic packaging in various applications. Module designers are challenged to create solutions that meet electrical, mechanical, thermal, and reliability requirements.
Figure 1. The panel of “RF/Microwave Packaging and Interconnect Technologies for Global Integration—Are We on the Right Track?”.
The panel “Tapping Power WIRELESSLY Everywhere? Technologies, Standards, and Impact in Our Life” took place at 12:00–1:30 p.m. on Thursday, 15 June 2023, and was organized by Prof. Alessandra Costanzo (University of Bologna), Prof. Naoki Shinohara (Kyoto University), and Prof. J.-C. Chiao (SMU) (Figure 2). The topics of discussion included safe and high-power transfer at microwave and millimeter-wave frequencies in industrial applications, far-field RF charging and transmitter designs, and wireless power transfer use cases in buildings and factories. Panelists Dr. Yuji Tanabe (AETERLINK), Dr. Minoru Furukawa (Space Power Technologies), Dr. Hiroyuki Tani (Panasonic), Dr. Hatem Zeine (Ossia), and Dr. Jason Gill (PowerCAST) discussed products, application scenarios, customer needs and business ecosystems, challenges, software and hardware integration, and global standards.
Figure 2. The “Tapping Power WIRELESSLY Everywhere? Technologies, Standards, and Impact in Our Life” panel.
The details of these two panels have already been described in the program proceedings of IMS 2023, in which readers can find out more about the essence of these two ISTPs. This is the fourth ISTP event after six panels held at IMS 2021 (virtual), IMS 2022 (Denver, CO, USA), and European Microwave Week (EuMW) 2022 (Milan, Italy). They have been reported in the January, February, and August 2023 issues of IEEE Microwave Magazine. Two panels are organized for EuMW 2023 in Berlin, Germany, on 19 and 20 September 2023. The panels will discuss the practical issues of utilizing electromagnetic waves for biomedical applications and wireless power transfer. With the MTT-S’s outreach efforts, the first ISTP program will be organized for the Asia Pacific Microwave Conference (APMC 2023) in Taipei, Taiwan, on 5–8 December 2023. Two panels focusing on 5G/6G communication and semiconductor technologies and applications of RF technologies in senior care are organized. Please see their program details on the EuMW and APMC websites.
The MTT-S ISTP program warmly embraces the collaborative spirit and synergistic efforts of cross-disciplinary colleagues. The MTT-S Inter-Society Committee extends an invitation to all those who advocate for multidisciplinary and cross-societal topics related to the MTT-S fields of interest. If you are interested in this initiative and would like to be actively involved in organizing a future ISTP, we wholeheartedly encourage you to reach out to Ke Wu (ke.wu@ieee.org) and J.-C. Chiao (chiao@ieee.org). Your participation and contributions are greatly valued and welcomed!
Digital Object Identifier 10.1109/MMM.2023.3311647