Robert H. Caverly
©SHUTTERSTOCK.COM/ANDREY SUSLOV
As can be seen from the cover image on this issue of IEEE Microwave Magazine, this month’s issue focuses on aerospace applications of microwave engineering. This second part of the IEEE Microwave Theory and Technology Society (MTT-S) Technical Committee 29 (Microwave Aerospace Systems) focus issue concludes with two articles [A1], [A2] that have a direct focus on the components and technologies in aerospace-related applications. I would like to once again thank Guest Editors Nelson Fonseca and Christian Waldschmidt for their organization, constant communication, and quick responses to requests that made this an easy focus issue to plan (at least on the editor’s end!). Please read their “From the Guest Editors’ Desk” column [A3] for a summary of the two articles in this focus issue. In addition to the two aerospace-related focus issue articles, we round out the technical portion of the issue with a third article [A4] that looks at radiative wireless power transfer systems and then provides insights into the future potential of wireless power transfer related to both the technology and potential applications.
As we do every month, we present the MTT-S “President’s Column” [A5]; here, Nuno Borges Carvalho talks about conferences that occur early in 2023 as well as some of the MTT-S Administrative Committee (AdCom) standing committees, their work, and their chairs. In particular, Carvalho discusses the inaugural edition of the International Microwave and Antennas Symposium in Egypt this month. In our “MicroBusiness” column [A6], Fred Schindler talks about the occasional disconnect between those who work with science and engineering principles every day and those in the general population who generally do not.
In addition to the focus on aerospace technology this month, we have quite a few columns that describe the wide range of activities that have occurred internationally and focus on the MTT-S membership experience. The MTT-S “Society News” column [A7] presents the activities of the Inter-Society Technology Panel at the 2022 International Microwave Symposium (IMS2022), while the “Around the Globe” column [A8] talks about the most recent Chapter Chair meeting at the third annual meeting of the MTT-S AdCom. These Chapter Chair meetings are where the chairs meet with the MTT-S AdCom to share their experiences and best practices—all to bring the best of MTT-S membership benefits to you. I would like to thank Jan Machácˇ and Daniel Pasquet for taking the time to generate their report so that you can see the work behind your Chapter and Section meeting activities.
In the “Women in Microwaves” column [A9], Grosinger et al. discuss the Distinguished Microwave Lecturer (DML) program and the nomination and selection process as well as the current DMLs available for Chapter and Section lectures. Somak Bhattacharya presents some of the activities happening in his Chapter in the “Young Professionals” column [A10]. The MTT-S Ombuds officer describes his recent interactions with MTT-S members and discusses the issues brought to him and their resolutions [A11].
While not a direct column from the MTT-S Education Committee, there is an announcement [A12] for the various student fellowships and scholarships available from the MTT-S. Our “Conference Report” [A13], [A14] column contains two reports this month, with the first from the 2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT 2022) organizers outlining their successful conference in Busan, South Korea. The second report is on the 2022 International Conference on Microwave Acoustics and Mechanics (IC-MAM) conference held in Munich, Germany. Don’t forget to check out the “Conference Calendar” [A15] for a look at future conferences and venues. As you can see from the long list of activities, the MTT-S helps provide many activities as a benefit of your membership. I encourage you to take part in as many of the future activities that you can.
Finally, we have other columns that may be of interest to you. Our “New Products” editor has another installment outlining six products that have come across his desk [A16]. We also have some technical challenges for you to consider in both the “Enigmas, etc.” [A17] and “Educator’s Corner” [A18] columns this month.
We hope you enjoy the issue!
[A1] G. Amendola et al., “Low-earth orbit user segment in the Ku and Ka-band,” IEEE Microw. Mag., vol. 24, no. 2, pp. 32–48, Feb. 2023, doi: 10.1109/MMM.2022.3217961.
[A2] J. Budroweit, “RF systems on chip and mixed-signal front-end devices,” IEEE Microw. Mag., vol. 24, no. 2, pp. 49–56, Feb. 2023, doi: 10.1109/MMM.2022.3217988.
[A3] N. J. G. Fonseca and C. Waldschmidt, “Aerospace applications: Part 2,” IEEE Microw. Mag., vol. 24, no. 2, pp. 30–31, Feb. 2023, doi: 10.1109/MMM.2022.3220835.
[A4] V. Palazzi et al., “Radiative wireless power transfer,” IEEE Microw. Mag., vol. 24, no. 2, pp. 57–79, Feb. 2023, doi: 10.1109/MMM.2022.3210145.
[A5] N. B. Carvalho, “New challenges for MTT members—Increase the value of our membership worldwide,” IEEE Microw. Mag., vol. 24, no. 2, pp. 10–12, Feb. 2023, doi: 10.1109/MMM.2022.3220311.
[A6] F. Schindler, “For the love of science,” IEEE Microw. Mag., vol. 24, no. 2, pp. 14–15, Feb. 2023, doi: 10.1109/MMM.2022.3220312.
[A7] J. Grosinger, K. Wu, O. Eliezer, and J.-C. Chiao, “The inter-society technology panels at IMS 2022,” IEEE Microw. Mag., vol. 24, no. 2, p. 24, Feb. 2023, doi: 10.1109/MMM.2022.3218200.
[A8] J. Machácˇ and D. Pasquet, “Region 8 IEEE MTT-S chapter officers meeting,” IEEE Microw. Mag., vol. 24, no. 2, pp. 25–29, Feb. 2023, doi: 10.1109/MMM.2022.3220037.
[A9] J. Grosinger, D. Jiao, M. Jarrahi, D. Schreurs, and N. Nikolova, “Distinguished microwave lectures: An enriching experience for MTT-S members and speakers,” IEEE Microw. Mag., vol. 24, no. 2, pp. 80–81, Feb. 2023, doi: 10.1109/MMM.2022.3220038.
[A10] S. Bhattacharya, “Report of webinar on ‘Opportunity in Chaos (Next-Generation Wireless Technologies)’,” IEEE Microw. Mag., vol. 24, no. 2, pp. 86–87, Feb. 2023, doi: 10.1109/MMM.2022.3218237.
[A11] E. C. Niehenke, “MTT-S Ombuds Officer,” IEEE Microw. Mag., vol. 24, no. 2, pp. 88–89, Feb. 2023, doi: 10.1109/MMM.2022.3218916.
[A12] “The 2023 IEEE MTT-S undergraduate/pre-graduate scholarship awards,” IEEE Microw. Mag., vol. 24, no. 2, p. 8, Feb. 2023, doi: 10.1109/MMM.2022.3221248.
[A13] H. Kim, “The 14th IEEE RFIT symposium, in Busan, South Korea,” IEEE Microw. Mag., vol. 24, no. 2, pp. 16–19, Feb. 2023, doi: 10.1109/MMM.2022.3220099.
[A14] A. Hagelauer and H. Maune, “International conference on microwave acoustics & mechanics,” IEEE Microw. Mag., vol. 24, no. 2, pp. 20–23, Feb. 2023, doi: 10.1109/MMM. 2022.3220100.
[A15] “Conference calendar,” IEEE Microw. Mag., vol. 24, no. 2, p. 94, Feb. 2023, doi: 10.1109/MMM.2022.3220313.
[A16] K. Mays, “New products,” IEEE Microw. Mag., vol. 24, no. 2, pp. 82–85, Feb. 2023, doi: 10.1109/MMM.2022.3218199.
[A17] T. Ohira, “Solution to last month’s quiz,” IEEE Microw. Mag., vol. 24, no. 2, pp. 92–93, Feb. 2023, doi: 10.1109/MMM.2022. 3218178.
[A18] S. C. Dutta Roy and S. Rao Nelatury, “A uniform distributed RC bandpass network gives more than unity gain,” IEEE Microw. Mag., vol. 24, no. 2, pp. 90–91, Feb. 2023, doi: 10.1109/MMM.2022.3218177.
Digital Object Identifier 10.1109/MMM.2022.3222601